feb.2004 CM200DU-24NFH application high frequency switching use (30khz to 60khz). gradient amplifier, induction heating, power supply, etc. mitsubishi igbt modules CM200DU-24NFH high power switching use ? i c ................................................................... 200a ? v ces ......................................................... 1200v ? insulated type ? 2-elements in a pack outline drawing & circuit diagram dimensions in mm circuit diagram c2e1 e2 c1 g2 e2 e1 g1 e1 e2 g2 g1 cm c1 e2 c2e1 label 4- 6. 5 mouting holes 3-m6 nuts 108 29 +1.0 ?.5 62 18 7 18 7 18 8.5 22 4 93 0.25 48 0.25 2.8 4 7.5 6 15 6 0.5 0.5 0.5 0.5 14 14 14 25 2.5 21.5 25 t c measured point
feb.2004 gate-emitter threshold voltage thermal resistance *1 collector-emitter voltage gate-emitter voltage maximum collector dissipation maximum collector dissipation junction temperature storage temperature isolation voltage weight v ce = v ces , v ge = 0v v ge = v ges , v ce = 0v t j = 25 c t j = 125 c v cc = 600v, i c = 200a, v ge = 15v v cc = 600v, i c = 200a v ge1 = v ge2 = 15v r g = 1.6 ? , inductive load switching operation i e = 200a i e = 200a, v ge = 0v igbt part (1/2 module) fwdi part (1/2 module) case to fin, thermal compound applied *2 (1/2 module) igbt part (1/2 module) fwdi part (1/2 module) i c = 20ma, v ce = 10v i c = 200a, v ge = 15v v ce = 10v v ge = 0v 1200 20 200 400 200 400 830 1300 ?0 ~ +150 ?0 ~ +125 2500 3.5 ~ 4.5 3.5 ~ 4.5 400 mitsubishi igbt modules CM200DU-24NFH high power switching use v v a a a a w w c c v n ?m n ?m g 1 0.7 6.5 32 2.7 0.6 300 80 500 150 250 3.5 0.15 0.24 0.095 *3 0.14 *3 16 ma a nf nf nf nc ns ns ns ns c v c/w c/w c/w c/w c/w ? 5.0 5.0 900 7.5 0.04 1.6 6v v 4.5 7.5 ns collector cutoff current gate leakage current collector-emitter saturation voltage (note 4) input capacitance output capacitance reverse transfer capacitance total gate charge turn-on delay time turn-on rise time turn-off delay time turn-off fall time reverse recovery time reverse recovery charge emitter-collector voltage contact thermal resistance thermal resistance *4 external gate resistance i ces i ges c ies c oes c res q g t d(on) t r t d(off) t f t rr ( note 1 ) q rr ( note 1 ) v ec( note 1 ) r th(j-c) q r th(j-c) r r th(c-f) r th(j-c? q r th(j-c? r r g symbol parameter v ge(th) v ce(sat) * 1 : t c measured point is shown in page outline drawing. * 2 : typical value is measured by using shin-etsu silicone ?-746? * 3 : if you use this value, r th(f-a) should be measured just under the chips. * 4 : t c ?measured point is just under the chips. note 1. i e , v ec , t rr & q rr represent characteristics of the anti-parallel, emitter to collector free-wheel diode (fwdi). 2. pulse width and repetition rate should be such that the device junction temp. (t j ) does not exceed t jmax rating. 3. junction temperature (t j ) should not increase beyond 150 c. 4. no short circuit capability is designed. g-e short c-e short operation (note 2) pulse (note 2) operation (note 2) pulse (note 2) t c = 25 c t c ?= 25 c *4 main terminal to base plate, ac 1 min. main terminal m6 mounting holes m6 typical value symbol parameter collector current emitter current mounting torque conditions unit ratings v ces v ges i c i cm i e ( note 1 ) i em ( note 1 ) p c ( note 3 ) p c ( note 3 ) t j t stg v iso unit typ. limits min. max. test conditions maximum ratings (tj = 25 c) electrical characteristics (tj = 25 c)
feb.2004 mitsubishi igbt modules CM200DU-24NFH high power switching use 10 1 10 0 10 1 10 2 2 3 5 7 2 3 5 7 2 3 5 7 14 10 1 2 10 0 357 2 10 1 357 2 10 2 357 v ge = 0v c ies c oes c res 0 5 101520 v ce = 10v 0 1 6 7 8 9 2 3 4 5 0 50 100 150 200 350 400 250 300 t j = 25 c t j = 125 c v ge = 15v 0 50 100 150 200 250 300 350 400 0246810 0 50 100 150 200 250 300 350 400 v ge =20 (v) t j = 25 c 12 9 8 11 10 13 0 2 4 6 8 10 6101418 8121620 t j = 25 c i c = 400a i c = 200a i c = 80a 10 1 10 2 2 3 5 7 012 4 35 10 3 2 3 5 7 t j = 25 c t j = 125 c 15 t j = 25 c t j = 125 c free-wheel diode forward characteristics ( typical ) emitter current i e ( a ) emitter-collector voltage v ec ( v ) capacitance characteristics ( typical ) capacitance c ies , c oes , c res ( nf ) collector-emitter voltage v ce ( v ) output characteristics ( typical ) collector current i c ( a ) transfer characteristics ( typical ) collector current i c ( a ) gate-emitter voltage v ge ( v ) collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( a ) collector-emitter saturation voltage characteristics ( typical ) collector-emitter saturation voltage characteristics ( typical ) collector-emitter voltage v ce ( v ) collector-emitter saturation voltage v ce(sat) ( v ) gate-emitter voltage v ge ( v ) performance curves
feb.2004 mitsubishi igbt modules CM200DU-24NFH high power switching use 10 1 10 2 23 57 10 3 23 57 10 1 10 2 2 3 5 7 10 3 2 3 5 7 t j = 25 c t rr i rr 10 1 10 2 23 57 10 3 23 57 2 3 5 7 2 3 5 7 10 0 10 2 10 1 10 3 2 3 5 7 t d(off) t d(on) t f t r 0 5 10 15 20 0 200 400 600 800 1000 1200 1400 v cc = 600v v cc = 400v i c = 200a conditions: v cc = 600v v ge = 15v r g = 1.6 ? t j = 125 c inductive load conditions: v cc = 600v v ge = 15v r g = 1.6 ? t j = 25 c inductive load 10 3 10 5 10 4 10 0 7 5 3 2 10 2 7 5 3 2 10 1 7 5 3 2 10 3 23 57 23 57 23 57 23 57 10 1 10 2 10 1 10 0 10 3 10 3 7 5 3 2 10 2 7 5 3 2 10 1 23 57 23 57 single pulse t c = 25 c per unit base = r th(j c) = 0.15 c/w 10 3 10 5 10 4 10 0 7 5 3 2 10 2 7 5 3 2 10 1 7 5 3 2 10 3 23 57 23 57 23 57 23 57 10 1 10 2 10 1 10 0 10 3 10 3 7 5 3 2 10 2 7 5 3 2 10 1 23 57 23 57 single pulse t c = 25 c per unit base = r th(j c) = 0.24 c/w 10 1 10 2 2 3 5 7 10 3 2 3 5 7 transient thermal impedance characteristics ( igbt part ) time ( s ) normalized transient thermal impedance z th(j c) half-bridge switching time characteristics ( typical ) switching time ( ns ) collector current i c ( a ) reverse recovery characteristics of free-wheel diode ( typical ) reverse recovery time t rr ( ns ) emitter current i e ( a ) reverse recovery current i rr ( a ) gate charge characteristics ( typical ) gate-emitter voltage v ge ( v ) gate charge q g ( nc ) time ( s ) transient thermal impedance characteristics ( fwdi part ) normalized transient thermal impedance z th(j c)
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